Printed Circuit Boards

When it comes to PC Board supply L.P. International has the answer.

Below you will find our Manufacturing Capability now and what is currently under development and near completion. Make note of our Material List & Applications. Our Quality Assurance System is applied to arrival of material and components, while boards are in process and when completed. Quality and reliability are our hallmark.

Material List & Application
FR-4	General Electronic Product
FR-5	Burn-in board, Power supply
BT	PBGA, Burn-in, IC Card
Polyimide 85N	Military, Burn-in, Power supply
Exposy 45N	Back Plane, Burn-in, BGA…
Aluminum	Power Supply, Motor Engine
Teflon	RF, LNB, LNA, Base Station
Duroid	RF, LNB, LNA, Base Station
RO3003/4003	RF, LNB, LNA, Base Station

 

Manufacturing Capability
Technology  Description	Now	Under Development
Minimum Trace/Space  (inner/outer)	5/5 mils	4/4 mils
Minimum Finished Hole Diameter	10 mils	6 mils
Maximum Aspect Ratio	8:1	10:1
Minimum Board Thickness – 4 layer	16 mils	12 mils
Minimum Board Thickness – 6 layer	24 mils	22 mils
Maximum Board Thickness	125 mils	125 mils
Minimum/Maximum Layer	2/16	up to 20
Minimum SMT Device Pitch	12 mils	10 mils
Minimum SMT Device Land Width	8 mils	6 mils
Board Flatness Tolerance	0.7%	0.5%
Layer to Layer Reg.  Tolerance	5  mils	4  mils
Impedance	10%	8%
Entek/Gold Plating	Yes	Yes

 

Found the manufacturing process, product or service you need?

David is ready to receive your call, e-mail, CAD & E- Drawings, Prints and photos. Contact him and start your project with the knowledge you are working with a Product Developer and Project Manager with over thirty years experience.

Send your proposal now.