Printed Circuit Boards
When it comes to PC Board supply L.P. International has the answer.
Below you will find our Manufacturing Capability now and what is currently under development and near completion. Make note of our Material List & Applications. Our Quality Assurance System is applied to arrival of material and components, while boards are in process and when completed. Quality and reliability are our hallmark.
Material List & Application | |
FR-4 | General Electronic Product |
FR-5 | Burn-in board, Power supply |
BT | PBGA, Burn-in, IC Card |
Polyimide 85N | Military, Burn-in, Power supply |
Exposy 45N | Back Plane, Burn-in, BGA… |
Aluminum | Power Supply, Motor Engine |
Teflon | RF, LNB, LNA, Base Station |
Duroid | RF, LNB, LNA, Base Station |
RO3003/4003 | RF, LNB, LNA, Base Station |
Manufacturing Capability | ||
Technology Description | Now | Under Development |
Minimum Trace/Space (inner/outer) | 5/5 mils | 4/4 mils |
Minimum Finished Hole Diameter | 10 mils | 6 mils |
Maximum Aspect Ratio | 8:1 | 10:1 |
Minimum Board Thickness – 4 layer | 16 mils | 12 mils |
Minimum Board Thickness – 6 layer | 24 mils | 22 mils |
Maximum Board Thickness | 125 mils | 125 mils |
Minimum/Maximum Layer | 2/16 | up to 20 |
Minimum SMT Device Pitch | 12 mils | 10 mils |
Minimum SMT Device Land Width | 8 mils | 6 mils |
Board Flatness Tolerance | ![]() |
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Layer to Layer Reg. Tolerance | ![]() |
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Impedance | ![]() |
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Entek/Gold Plating | Yes | Yes |
Found the manufacturing process, product or service you need?
David is ready to receive your call, e-mail, CAD & E- Drawings, Prints and photos. Contact him and start your project with the knowledge you are working with a Product Developer and Project Manager with over thirty years experience.
Send your proposal now.